Qualcomm announces new MSM7X30 mainstream chipsets & first Dual-carrier LTE chipsets

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Qualcomm is announcing a new line of mainstrem chipset today based on the their Scorpion CPU core (the same one found in the SnapDragon chipset):

SAN DIEGO, Nov. 12 /PRNewswire-FirstCall/ — Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of advanced wireless technologies, products and services, today announced that it is sampling a new smartphone chipset family that breaks new ground in mobile performance in the mainstream smartphone tier. The MSM7x30 family features a strong emphasis on multimedia performance, supporting high-definition video recording and playback, exceptional graphics with dedicated 2D and 3D cores, and an overall chip design optimized for a highly responsive, immersive Web experience. The first devices based on the flagship MSM7x30 family of chipsets are expected to launch commercially before the end of 2010.

“Qualcomm continues to focus on enabling the best possible mobile experiences and this new family of solutions brings an unmatched feature set to the smartphone segment,” said Alex Katouzian, vice president of product management for Qualcomm CDMA Technologies. “As the demand for smartphones continues to grow, our innovative technology will enable Qualcomm’s device manufacturing partners to deliver products with greater value than ever before.”

The MSM7x30 family of chipsets, which includes the MSM7230(TM) solution for HSPA+ networks and MSM7630(TM) solution with multi-mode HSPA+/EV-DO Rev. B and SV-DO support, is designed around optimal data throughput and powerful multimedia functionality. The 7×30 has the same market-leading Scorpion CPU as previously commercialized in the Snapdragon QSD8x50 chipset. The 7×30 uses an 800 MHz to 1 GHz custom superscalar CPU based on the ARM v7 instruction set, delivering exceptionally high-end processing at low power to support features that include:

•720p high-definition video encode/decode at 30 frames per second
•Integrated 2D and 3D graphics GPUs with support for OpenGL ES 2.0, and OpenVG 1.1 industry standard APIs
•Dedicated low-power audio subsystem supporting 5.1 surround
•12-megapixel camera support
•Integrated GPS for location-based services
•Support for leading mobile operating systems, including Android, Windows Mobile, Brew Mobile Platform and Symbian
•Support for package-on-package memory for reduced board space, optimized power consumption and more responsive performance

The MSM7x30 family of chipsets is supported by the PM8058(TM) power management integrated circuit and the QTR8600(TM) RF subsystem with integrated Bluetooth® and FM radio. MSM7x30 chipsets will directly interface with Qualcomm’s WCN1312(TM) WLAN solution for 802.11 b/g/n.

This doesn’t look like anything new to me. It has exactly the same specs as the SnapDragon chipset and I’m willing to bet that it’s just a 45nm version of the QSD8x50 platform (65nm). Remember that before being renamed QSD8x50 the SnapDragon SOC was named MSM7850….

THe San Diego chipmaker is also announcing the sampling of the first dual-carrier HSPA+ and Multi-Mode 3G/LTE Chipsets:

Dual-carrier HSPA+ and LTE are network innovations that provide the ability to deliver more advanced data capabilities to mobile devices, supporting more compelling applications and richer user experiences. A wide variety of network operators, infrastructure vendors and mobile device manufacturers are now working with Qualcomm to enable the deployment of these next-generation network technologies in new markets worldwide. Interoperability testing with infrastructure partners is already underway with multiple field trials scheduled for the first half of next year. Commercial launches of data-centric devices based on Qualcomm’s MDM solutions are expected to begin during the second half of 2010.

“Qualcomm leads the industry in enabling next-generation mobile experiences with highly integrated, powerful and elegant solutions for dual-carrier HSPA+ and LTE. We are pleased to be working with so many industry leaders to bring these advanced technologies to market,” said Alex Katouzian, vice president of product management, Qualcomm CDMA Technologies. “We remain committed to CDMA and OFDMA WAN modem leadership and the seamless and cost-effective commercialization of next-generation technologies around the world.”

Read the rest here

Source: Qualcomm